Sinotruk Successfully Raises 2nd Corporate Bond Offering in Hong Kong - RMB1.8 Billion

Temps:2013-06-01 10:59:01 Les coups:561

      Sinotruk (Hong Kong) Limited (“Sinotruk”, stock code “3808”) today announced that it has successfully placed a RMB-denominated 1.8billion two-year corporate bond with a coupon rate of 4.5% to institutional investors on August 1, 2012. Sinotruk is one of the few large mainland non-financial institutions to complete a second “dim-sum” offering in Hong Kong. The bond received an overwhelmingly positive response from the market.

The coupon rate of the Bond is 4.5% per annum. The issue date of the bond is August1,2012. The proceeds will be used for working capital, general corporate purposes and the repayment of outstanding indebtedness.
      Mr. Ma Chunji, Chairman of Sinotruk, commented, “We are pleasedto successfully raise funds again in the Hong Kong market since we, being thefirst large Chinese non-financial enterprise,haveissuedRMB corporate bonds in 2010.  We have been able to access funds to help us steadily build our business over time. This successful offering, which is one of the largest ‘dim-sum’ corporate bonds at the two-year tenor to be issued so far this year, reduces the Group’s operating costs and demonstrates the confidence that investors in the capital markets have shown in us. We would alsolike to express our gratitude to the regulatory authorities and our various business partners for their strong support.”
      Bank of China and Industrial and Commercial Bank of China (Asia) Limited acted as Joint GlobalCoordinators.Bank of China,IndustrialCommercial Bank of China (Asia) Limited, Morgan Stanley, Royal Bank of Scotland and Wing Lung Bank Limited areJointLead Managers and CCB International is co-lead manager of the issuance. 
 
  
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